Spectrum Webcasts

Tech Insider: Leveraging Multiphysics Solutions for Cost-Effective and Successful Electronic Design

"On Demand"

(Duration: 1 hour)

Panelists:

Bill Bulat
Technical Support Engineer, ANSYS, Inc.

Stephen Scampoli
Product Manager, ANSYS, Inc.

Omar Zohni, Ph.D.
Technical Support Engineer, ANSYS, Inc.

As companies strive to produce innovative and higher quality products, simulation continues to gain importance in the design of electronic and electromechanical devices. Engineers and designers are using simulation to evaluate electronics cooling, current distribution and thermal dissipation in integrated circuits, electromigration, thermoelectric cooling, high speed electronic circuits, and many other aspects of electronics design.

This presentation will focus on the critical simulation issues that are facing today's engineers designing semiconductors, MEMS, power electronics, and PCB boards. Important takeaways will include how to:

• Reduce engineering costs through process compression, working with real-world geometry, and optimizing Multiphysics solutions
• Increase efficiency by using fewer physical prototypes and test setups
• Obtain an increased ROI due to reduced development time, faster time to market, and the flexibility for modifications of designs at later stage of development

A live demonstration of ANSYS® Multiphysics (TM) will be presented to evaluate the thermal performance of a printed circuit board within a unified Multiphysics simulation environment.

Who should attend:

• Package designers
• Semiconductor/Component designers
• Mechanical designers
• MEMS designers
• Engineering management
• Project managers
• Academia