11 December 2007—Computer chips have become so dense
that packing even more transistors into them is forcing
engineers to break long-standing rules of transistor
design. Earlier this year, Intel
became the first company to get 45-nanometer chips
on the market by finding a way to make a
transistor with what's known as a high-k
dielectric. To make the transistors work, it
had to make the first fundamental change to transistor
design in nearly 40 years, switching to metal-gate
electrodes from silicon. Intel also had to use a new
manufacturing process and two different types of metal
to make the transistors. Now a team of engineers at
Semiconductor Leading Edge Technologies (Selete), a
research consortium for Japanese technology companies,
says it has worked out a new way of making
high-k
dielectric transistors that uses the common
manufacturing process and only a single type of metal.
A transistor is basically a switch: When you apply
voltage to the gate electrode, it opens or closes a
channel in the silicon for charge to flow. In an
n-type
transistor, electrons flow through the channel, whereas
in a p-type
transistor, it's actually the absence of electrons
(usually referred to as holes) that flows. Transistors
in microprocessors are usually arranged so that the two
varieties work in a complementary fashion. In these
transistors, the gate is separated from the chip surface
by a silicon-dioxide insulating layer. As transistors
have shrunk down over the decades, the oxide eventually
became so thin that it leaked electrons through it,
wasting power. Since the mid-1990s, chip makers have
been experimenting with replacing the silicon dioxide
with high-k
dielectrics—materials that can be made physically thick
(to stop electron leakage) but electrically thin (so
that the transistor turns on easily).
But high-k dielectrics have
problems of their own. Engineers have found that they
work only with metal gates instead of the silicon gates
in use since the late 1960s. In a gate made from
silicon, engineers dope the silicon with impurities to
control whether it is p-type (having excess
holes) or n-type (having excess
electrons). The gate has the opposite doping as the
channel—a p-type gate controls
an n-type
channel. Metal electrodes can't be doped. Instead,
researchers had to search for metals that happen to have
an electrical property called “work function,” which
makes them behave the same way as the doped silicon. For
Intel, this meant two metals: one whose work function
matched the p-type silicon
substrate and one that matched the n-type.
The Selete group effectively flipped this method on
its head, starting with a single metal whose work
function falls in between that of p-type and n-type silicon, and
using different high-k dielectrics to push
the effective work function toward one value or the
other. Using only one type of gate metal makes building
the transistor easier and helps control important
properties of the transistor, according to Yasuo Nara,
whose research group presented its findings yesterday at
the International Electron Devices Meeting, in
Washington, D.C.
Researchers noticed that during one of the critical
manufacturing steps in making
transistors—annealing—the interaction between the
high-k
dielectric and the metal gate changed the gate's
effective work function. Intel sought to avoid such a
change by going against the conventional procedures and
adding the gate after annealing.
But researchers at Selete decided to take advantage of
the change. Nara and his colleagues found that if they
added certain elements to the metal gate, the annealing
process drove the elements into the high-k dielectric,
changing its composition and predictably modifying the
effective work function. For p-type transistors,
they added aluminum, and for n-type, they added
magnesium. The result was two different high-k dielectrics but
only one metal gate.
It's not yet clear if Selete's method is a viable
alternative to Intel's technique, but it may be a new
way to attack a difficult problem. “We are not sure how
Japanese chip makers feel about our results,” writes
Nara by e-mail, but “we believe single-metal integration
is beneficial for fabrication.”